Current position: Home >> Scientific Research >> Patents

零件被加工表面几何误差的刀位规划补偿方法

Hits:

First Author:Sun Yuwen

Disigner of the Invention:jiazhenyuan,郭强,HANG GAO,Dongming Guo

Application Number:CN201110397181.2

Authorization Date:2011-12-02

Authorization number:CN102411337A

Pre One:一种半导体晶圆高效纳米精度减薄方法

Next One:一种多功能的基片磨抛装置及其磨抛方法
Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep