location: Current position: Home >> Scientific Research >> Paper Publications

Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5Ag0.5/Cu joints

Hits:

Date of Publication:2022-10-02

Journal:MICROELECTRONICS AND RELIABILITY

Affiliation of Author(s):机械工程学院

Volume:80

Page Number:55-67

ISSN No.:0026-2714

Pre One:Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows

Next One:In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage