location: Current position: Home >> Scientific Research >> Paper Publications

Charging method of micro heat pipe for high-power light-emitting diode

Hits:

Indexed by:Journal Papers

Date of Publication:2015-10-01

Journal:MICRO & NANO LETTERS

Included Journals:SCIE、EI、Scopus

Volume:10

Issue:10

Page Number:518-522

ISSN No.:1750-0443

Key Words:heat pipes; light emitting diodes; cooling; packaging; capillarity; microheat pipe; high-power light-emitting diode; working fluid charging; capillary force; conventional vacuum perfusion methods; peristaltic pump; thermal performance testing; heat dissipation; high-power LED; heat balance; working fluid perfusion; packaging manufacture; size 26 mm; size 20 mm; temperature 4; 5 degC; temperature 5; 1 degC

Abstract:Since high precision of working fluid charging is key to the evaluation of thermal performance, a novel perfusion method of a micro heat pipe (MHP) is presented. The MHP has a length of 26 mm, width of 20 mm and a thickness of similar to 2.2 mm. The predetermined quantity of perfusion is 25 or 35 l. Small volume and large capillary force render conventional vacuum perfusion methods quite impractical. To realise microscale and high precision of perfusion, the method of combining vacuum perfusion using a peristaltic pump and weight comparison before and after working fluid charging was used. The charging deviation of the method was <2 l. After perfusion and sealing, the thermal performance testing of a MHP, which is engineered in light-emitting diode (LED) heat dissipation, was conducted and the input power varied from 1 to 7 W. The results show that high-power LEDs can reach the status of heat balance and can work steadily, and the maximum deviations of actual and simulated temperatures are 4.5 and 5.1 degrees C, respectively, and the relative errors are 6.1 and 7.3%. Therefore, this perfusion method can be used for the working fluid perfusion of the MHP and makes it feasible for use in packaging manufacture of heat pipes.

Pre One:休斯光刻机汞灯电源原理与维修技术

Next One:A silicon-aluminum micro heat sink for light emitting diode (LED) chips