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基于IMC芯片的仪表高密度集成设计与模块开发

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Leading Scientist:解永平

Project Participants:Dong Weijie

Supported by:科技部重大专项

Sub-Class of Project:制造基础技术与关键部件

Status:在研

Supported by:重庆邮电大学

Nature of Project:纵向

Project Approval Number:2019YFB2005903

Date of Project Approval:2020-01-01

Scheduled completion time:2022-12-31

Date of Project Initiation:2020-01-01

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