location： Current position: Home >> Scientific Research >> Paper Publications

The Preparation for Cu(Sn) Films of Barrierless Interconnection

Hits:

Indexed by:期刊论文

Date of Publication:2010-01-01

Journal:Materials Science Forum

Volume:654

Issue:6

Page Number:1744-1747

Pre One:High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless Si

Next One:The effect of thermal aging on tensile property of HR3C steel
Recommended Ph.D.Supervisor Recommended MA Supervisor Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep