马海涛

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:材料科学与工程学院

办公地点:材料馆332

联系方式:15641188312

电子邮箱:htma@dlut.edu.cn

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Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates under temperature gradient

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论文类型:期刊论文

发表时间:2020-06-01

发表刊物:MATERIALS TODAY COMMUNICATIONS

收录刊物:EI、SCIE

卷号:23

ISSN号:2352-4928

关键字:3D packaging; Single crystal; Prism-type; Temperature gradient; Intermetallic alloys and compounds; Electronic materials

摘要:The morphology evolution of Cu6Sn5 grains in (001)Cu/Sn/Cu and (011)Cu/Sn/Cu micro solder joints reflowing with and without a temperature gradient was studied. In the as-soldered state, regular and perpendicular prism-type Cu6Sn5 grains formed on (001)Cu substrate, while a mixture of stubby prism-type and scallop-type Cu6Sn5 grains formed on (011)Cu substrate. The prism-type morphology gradually transferred into scallop-type after isothermally reflowed at 270 degrees C for 10 min. However, with a temperature gradient, the initial perpendicular small prismatic Cu6Sn5 grains on (001)Cu substrate and mixed-type Cu6Sn5 grains on (011)Cu continued to grow into large prism-type. All the prism-type Cu6Sn5 grains grew along same direction after long time reflow under temperature gradient due to the merging of adjacent Cu6Sn5 grain pair.