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论文类型：期刊论文

发表时间：2017-06-01

发表刊物：Joint 18th International Heat Pipe Conference (IHPC) / 12th International Heat Pipe Symposium (IHPS)

收录刊物：SCIE、EI、CPCI-S、Scopus

卷号：31

期号：6

页面范围：2621-2626

ISSN号：1738-494X

关键字：Encapsulation; Low-melting-point alloy; Micro heat pipe; Sealing

摘要：This study proposed a method using Low-melting-point alloy (LMPA) to seal Micro heat pipes (MHPs), which were made of Si substrates and glass covers. Corresponding MHP structures with charging and sealing channels were designed. Three different auxiliary structures were investigated to study the sealability of MHPs with LMPA. One structure is rectangular and the others are triangular with corner angles of 30A degrees and 45A degrees, respectively. Each auxiliary channel for LMPA is 0.5 mm wide and 135 mu m deep. LMPA was heated to molten state, injected to channels, and then cooled to room temperature. According to the material characteristic of LMPA, the alloy should swell in the following 12 hours to form strong interaction force between LMPA and Si walls. Experimental results show that the flow speed of liquid LMPA in channels plays an important role in sealing MHPs, and the sealing performance of triangular structures is always better than that of rectangular structure. Therefore, triangular structures are more suitable in sealing MHPs than rectangular ones. LMPA sealing is a plane packaging method that can be applied in the thermal management of high-power IC device and LEDs. Meanwhile, implanting in commercialized fabrication of MHP is easy.