点击次数：

论文类型：会议论文

发表时间：2013-11-03

收录刊物：EI、CPCI-S、Scopus

卷号：609-610

页面范围：891-897

关键字：piezoresistive; stresses; adhesive bonding

摘要：In this work, piezoresistive stress sensors test circuit fabricated into the sensitive structure as part of the normal processing procedure is used to measure the stresses difference distribution before and after the assembly. Sensor resistances were recorded before and after the adhesive bonding. Using the theoretical equations, the stresses on the die surface have been calculated from the data of sensor resistances. This technology not only provides a performance diagnostic tool for the sensitive structures and the miniature components, but also presents a design tool for low-stress micro-assemblies of miniature components.