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论文类型：期刊论文

发表时间：2017-10-30

发表刊物：MODERN PHYSICS LETTERS B

收录刊物：Scopus、SCIE

卷号：31

期号：30

ISSN号：0217-9849

关键字：Micro-heat pipe; micro-fabrication; thermal performance; hydraulic diameter

摘要：Increasing component densities of the integrated circuit (IC) and packaging levels has led to thermal management problems. Si substrates with embedded micro-heat pipes (MHPs) couple good thermal characteristics and cost savings associated with IC batch processing. The thermal performance of MHP is intimately related to the cross-sectional geometry. Different cross-sections are designed in order to enhance the backflow of working fluid. In this experimental study, three different Si MHPs with same hydraulic diameter and various cross-sections are fabricated by micro-fabrication methods and tested under different conditions of fluid charge ratios. The results show that the trapezoidal MHP associated with rectangular artery which is charged with 40% of vapor chambers volume has the best thermal performance. This silicon-based MHP is a passive approach for thermal management, which could widen applications in the commercial electronics industry and LED lightings.