点击次数：

论文类型：期刊论文

发表时间：2014-08-31

发表刊物：Key Engineering Materials

收录刊物：EI、Scopus

卷号：645

页面范围：208-215

ISSN号：10139826

摘要：With the excellent thermal conductivity and the compatibility to micro electromechanical systems technology, silicon is widely used in micro heat pipes (MHPs). Copper shows higher heat transfer capability and capillary traction than silicon. Copper pillars modified microgrooves were fabricated on the silicon wafer using electroforming technique in this paper. Water contact angle measurements and thermal behavior tests were employed to the fabricated microgrooves and MHPs. Under the input power of 4 W, how the working fluid flowed in the microgrooves and steam chamber was easily observed by digital camera. The experiments demonstrated the working fluid flowed via copper pillars instead of the silicon microgrooves due to the adhesive force between working fluid and copper pillars were larger than that between working fluid and silicon microgrooves. This work showed copper pillars had a better capillary traction than the silicon microgrooves, and could make the MHP work as a vapor chamber. ? (2015) Trans Tech Publications, Switzerland.