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论文类型：期刊论文

发表时间：2011-12-01

发表刊物：Journal of Harbin Institute of Technology (New Series)

收录刊物：EI、Scopus

卷号：18

期号：6

页面范围：139-142

ISSN号：10059113

摘要：In order to use micro ultrasonic bonding technique to package polymer microfluidic chips, an auxiliary microstructure named micro energy director is designed and fabricated. The hot embossing process for PMMA (polymethyl methacrylate) substrates with both concave micro channel and convex micro energy director for ultrasonic bonding is studied. The embossing processes with different embossing temperatures are simulated using Finite Element Method (FEM). The optimized parameters are: the embossing temperature of 135  C, holding time of 200 s, and the embossing pressure of 1.65 MPa. The experimental results show that the replication error between experiments and simulations is less than 2% and the replication accuracy of the microstructure is more than 96%.The study offers a method for quick optimizing parameters for hot embossing both concave and convex microstructures.