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Indexed by:期刊论文

Date of Publication:2013-11-01

Journal:SURFACE ENGINEERING

Included Journals:SCIE、EI、Scopus

Volume:29

Issue:10

Page Number:749-754

ISSN No.:0267-0844

Key Words:Ti-Si-N; Nanocomposite; Hardness; Adhesion

Abstract:The objective of this work is to settle the problem of adhesion between hard films and soft metal substrates. Hard Ti-Si-N films were deposited onto soft Al substrates with a double target magnetron sputtering system. The composition, structure, surface morphologies and mechanical properties were characterised by electron probe microanalyser, X-ray diffraction, atomic force microscope, scratch test and nanoindentation respectively. The as-deposited films had good adhesion to the Al substrates and had a smooth and lustrous surface. The maximum hardness of the films achieved was as high as 27.2 GPa at the Si target power of 80 W.