Current position: Home >> Scientific Research >> Patents

导体电爆炸等离子体基低能金属离子注入装置

Hits:

First Author:leimingkai

Disigner of the Invention:张锋刚,Zhu XiaoPeng

Authorization Date:2009-05-25

Authorization number:CN101845616A

Pre One:在零件内表面热喷涂可控成分与结构涂层的致密化制备方法

Next One:泡沫塑料高功率脉冲磁控溅射表面金属化方法