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基于芯片制造的超薄硅片晶圆超窄缝切割关键技术

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Leading Scientist:zhangzhenyu

Supported by:地市厅局(含县)项目

Status:结题

Supported by:大连市科技局

Nature of Project:纵向

Project Approval Number:2009A18GX014

Date of Project Approval:2009-01-01

Scheduled completion time:2011-12-31

Date of Project Initiation:2010-01-01

Date of Project Completion:2023-09-13

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