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论文类型：会议论文

发表时间：2012-08-13

收录刊物：EI、CPCI-S、Scopus

页面范围：422-424

摘要：With the development of surface mount technology, solders are required for applications that require high reliability and dimensional stability. Composite solders, reinforced with particles in a conventional solder alloy, is an attractive and potential method. This study presents series results on the binary eutectic Sn-Bi composite solders reinforced with Cu6Sn5 particles (0.5wt.% and 1 wt.%). With this process, the wettability of composite solders was accepted although they were worse than that of Sn-58Bi. Compared with the spread area of Sn-58Bi, that of Sn-58Bi-1wt.%Cu6Sn5 was reduced about 10% after reflowing for 30min. The reinforcement particles were well dispersed in the solder matrix and refined the grain size of beta-Sn and Bi-rich phase. During the liquid interfacial reaction, the size of interfacial IMC was increased with reflowing time and it got larger for the addition of Cu6Sn5. The shear strength of composite solder joints was higher than that of Sn-58Bi/Cu. The fracture modes of composite solder were mainly ductile while that of Sn-58Bi/Cu was brittle when epsilon over dot = 9x10(-3)s(-1).