location: Current position: Home >> Scientific Research >> Paper Publications

Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemical Polishing

Hits:

Date of Publication:2022-10-08

Journal:JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Affiliation of Author(s):运载工程与力学学部

Volume:167

Issue:16

ISSN No.:0013-4651

Pre One:Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Next One:Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechanical polishing