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A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers.

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Indexed by:Journal Papers

Date of Publication:2016-04-29

Journal:International Journal of Machine Tools and Manufacture

Included Journals:SCI

Volume:107

Page Number:1-7

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2016-A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers.pdf

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