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论文类型：期刊论文

发表时间：2014-05-01

发表刊物：INTERNATIONAL JOURNAL OF MATERIALS RESEARCH

收录刊物：SCIE、EI、Scopus

卷号：105

期号：5

页面范围：462-468

ISSN号：1862-5282

关键字：Aluminum; Magnesium alloys; Ni-P; Conversion coating; Electroless plating

摘要：For the first time, the present study investigates the preparation of Al/Mg bimetal using Ni-based conversion plating and Ni-P electroless plating by means of diffusion bonding. In this study, AZ31 alloy was coated with an Ni-based interlayer by conversion plating and an Ni-P interlayer by electroless plating; the Al/Mg bimetallic materials were prepared by diffusion bonding in an air atmosphere. For conversion plating, the thickness of the Ni-based layer is several hundred nanometers. When heat-treated at 450 C for 90 min, most of the interfaces between Al and AZ31 alloy bond together well. For electroless plating, the thickness of the Ni-P layer is about 10 mu m for a plating time of 60 min. When heat-treated at 450 degrees C for 150 min, good bonding between pure Al and AZ31 can be obtained.