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Surface characteristics and material removal mechanisms during nanogrinding on C-face and Si-face of 4H-SiC crystals: Experimental and molecular dynamics insights

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Date of Publication:2024-06-01

Journal:Applied Surface Science

Volume:665

ISSN No.:0169-4332

Key Words:4h-SiC; C-face; Cost effective; Cost effectiveness; Ductile fracture; Fracture toughness; Grinding (machining); Material removal mechanisms; Molecular dynamics; Morphology; Nano-grinding; Power devices; Radio frequency devices; Si faces; Silicon wafers; Single crystals; Surface characteristics; Surface materials; Surface morphology; Surface roughness

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