高尚
个人信息Personal Information
教授
博士生导师
硕士生导师
性别:男
毕业院校:大连理工大学
学位:博士
所在单位:机械工程学院
学科:机械制造及其自动化
办公地点:机械工程学院高性能制造研究所#5015室
联系方式:手机:15104088992
电子邮箱:gaoshang@dlut.edu.cn
扫描关注
- [1]朱祥龙.Study into grinding force in back grinding of wafer with outer rim[J],Advances in Manufacturing,2022,8(3):361-368
- [2]高尚.Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel[J],Advanced materials research,2022,126-128:113-118
- [3]康仁科.Study on Grinding Performance of Soft Abrasive Wheel for Silicon Wafer[A],ADVANCES IN GRINDING AND ABRASIVE TECHNOLOGY XV,2022,416:529-534
- [4]康仁科.Study on grinding performance of soft abrasive wheel for silicon wafer[J],KEY ENGINEERING MATERIALS,2022,416:529-534
- [5]高尚.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],18th International Symposium on Advances in Abrasive Technology, ISAAT 2015,2022
- [6]高尚.Surface integrity and removal mechanism in grinding sapphire wafers with novel vitrified bond d...[J],MATERIALS AND MANUFACTURING PROCESSES,2022,32(2):121-126
- [7]董志刚.Surface integrity and removal mechanism of chemical mechanical grinding of silicon wafers using...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,83(5-8):1231-1239
- [8]高尚.Surface integrity and removal mechanism of silicon wafers in chemo-mechanical grinding using a ...[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,63:97-106
- [9]高尚.Surface layer damage of quartz glass induced by ultra-precision grinding with different grit size[A],The Second International Conference on Applied Engineering, Materials and Mechanics (ICAEMM 2017),2022,872:19-24
- [10]康仁科.Surface layer damage of silicon wafers sliced by wire saw process[J],Advanced materials research,2022,797:685-690
- [11]高尚.Recent advances in micro- and nano-machining technologies[J],机械工程前沿,2022,12(1,SI):18-32
- [12]Liu, H.J..Development of a measuring equipment for silicon wafer warp[J],Advanced materials research,2022,797:561-565
- [13]高尚.Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEE,2022,40:87-93
- [14]Liu, Haijun.ANALYSIS OF FACTORS AFFECTING GRAVITY-INDUCED DEFLECTION FOR LARGE AND THIN WAFERS IN FLATNESS ...[J],Metrology and Measurement Systems,2022,22(4):531-546
- [15]张玉.A new model of grit cutting depth in wafer rotational grinding considering the effect of the grin...[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2022,72:461-468
- [16]杨国林.A novel reverse helical milling process for reducing push-out delamination of CFRP[J],COMPOSITE STRUCTURES,2022,253
- [17]高尚.Design and evaluation of soft abrasive grinding wheels for silicon wafers[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B JOURNAL OF EN,2022,227(B4):578-586
- [18]Wu, Y. Q..Deformation patterns and fracture stress of beta-phase gallium oxide single crystal obtained us...[J],JOURNAL OF MATERIALS SCIENCE,2022,54(3):1958-1966
- [19]高尚.Nanogrinding induced surface and deformation mechanism of single crystal beta-Ga2O3[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2022,79:165-170
- [20]董志刚.Grinding performance evaluation of the developed chemo-mechanical grinding (CMG) tools for sapphi...[J],Advanced materials research,2022,565:105-110