王云鹏

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:东京大学

学位:博士

所在单位:材料科学与工程学院

电子邮箱:yunpengw@dlut.edu.cn

扫描关注

论文成果

当前位置: 中文主页 >> 科学研究 >> 论文成果

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

点击次数:

论文类型:期刊论文

发表时间:2018-05-01

发表刊物:INTERMETALLICS

收录刊物:SCIE、EI

卷号:96

页面范围:1-12

ISSN号:0966-9795

关键字:Intermetallics; In situ; Joining; Interfaces; Finite-element modeling

摘要:Evolution behavior and growth kinetics of Sn/Cu interfacial intermetallic compound (IMC) during multiple reflows were investigated. Scanning electron microscope (SEM) and shanghai synchrotron radiation facility (SSRF) images have shown that, scallop Cu6Sn5, formed at interface during the heating stage of a reflow, converted to facet type during subsequent cooling, and transformed back to the scalloped grains with larger size during the next re-heating stage. Furthermore, the value of IMC growth time exponent n during soldering gradually changed from 0.405 to 0.485 while nearly kept 1 during cooling and heating with reflow times. In addition, n was 0.613 for the overall multiple reflow process.