location: Current position: Home >> Scientific Research >> Paper Publications

Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scanning interferometry (WLSI)

Hits:

Date of Publication:2022-10-09

Journal:OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION XI

Volume:11056

ISSN No.:0277-786X

Pre One:Formation of subsurface cracks in silicon wafers by grinding

Next One:选区激光熔化马氏体时效钢(18Ni300)工艺参数研究