Indexed by:期刊论文

First Author:Sun, Xueyan

Correspondence Author:Tao, SY (reprint author), Dalian Univ Technol, Dept Chem, Dalian 116024, Peoples R China.; Qiu, JS (reprint author), Dalian Univ Technol, Liaoning Key Lab Energy Mat & Chem Engn, Sch Chem Engn, State Key Lab Fine Chem, Dalian 116024, Peoples R China.

Co-author:Zhang, Lijing,Tao, Shengyang,Yu, Yongxian,Li, Sijie,Wang, Han,Qiu, Jieshan

Date of Publication:2017-07-21

Journal:ADVANCED MATERIALS INTERFACES

Included Journals:SCIE、Scopus

Volume:4

Issue:14

ISSN No.:2196-7350

Key Words:copper circuits; electroless deposition; flexible electronics; swelling-induced

Abstract:A universal, surface swelling-induced strategy-based facile electroless deposition method is developed to prepare copper circuits on various polymer substrates. The circuits are grown on silver catalytic centers written in the form of set patterns, rather than via standard reducing material manufacturing, and can be easily erased and repeatedly deposited three times with only a 15% decrease in conductivity. Polymers with different hardness and flexibility are selected as circuit base boards. In addition to hard acrylonitrile butadiene styrene resins, a flexible polyimide-based copper circuit yields excellent flexural performance, whereas a stretchable silicon rubber-based circuit exhibits different response to different ranges of finger motions. These results demonstrate the significant advantages of this new strategy-namely, low cost, simple operation, and versatility, showing its great potential in the field of flexible electronics.