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论文类型：期刊论文

发表时间：2019-10-01

发表刊物：TRIBOLOGY INTERNATIONAL

收录刊物：SCIE、EI

卷号：138

页面范围：307-315

ISSN号：0301-679X

关键字：CMP; Pad asperity; Material removal rate; Chemical-mechanical synergy

摘要：The performance of chemical mechanical polishing (CMP) has been found highly dependent on the pad-work-piece contact status, which is far from theoretical understanding. To this end, a physically-based material removal rate (MRR) model is developed under pad-asperity scale. The theoretical predictions agree well with the experimental results no matter the contact spots distribution is dispersed or concentrated. It is found that the deterioration of MRR is attributed to the continuously reduced number of reacted atoms in each individual contact spot and the inadequate time for chemical reaction between successive contact spots. The present model is expected to facilitate the clarification of the effect of contact status on MRR, and further provide a strategy for CMP mechanisms investigation.