Current position: Home >> Scientific Research >> Patents

低电阻率高热稳定性的Cu-Ni-Mo合金薄膜及其制备工艺

Hits:

First Author:lixiaona

Disigner of the Invention:张心怡,朱瑾,wangqing,dongchuang

Authorization number:ZL 201080067138.3

Pre One:一种可变带隙的Fe-B-Si三元半导体非晶薄膜及其制备方法

Next One:一种用团簇固溶模型稳定N的高硬度Cu合金薄膜及其制备方法
Institutional Repository Personal Page

Address: No.2 Linggong Road, Ganjingzi District, Dalian City, Liaoning Province, P.R.C., 116024

Click : times
  • MOBILE Version
    •
    Open time:..
    The Last Update Time:..

    Mobile phone sweep