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论文类型：期刊论文

发表时间：2018-11-01

发表刊物：INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

收录刊物：SCIE、Scopus

卷号：148

页面范围：667-675

ISSN号：0020-7403

关键字：Modeling; Indentation fracture mechanic; Silicon carbide; Ultrasonic assisted scratching; Material removal rate

摘要：Ultrasonic assisted grinding (UAG) has been demonstrated to be effective for processing hard and brittle materials. In some of the current UAG models, the high efficiency of UAG was attributed to the great maximum momentary force brought by ultrasonic vibration. However, the models were built based on multi-grains behavior which lacks of necessary support by single-grain models and experiments. In this paper, a model for ultrasonic assisted scratching (UAS) was proposed to investigate the cutting behavior of single-grains. The experiments with and without ultrasonic assistance were both conducted on a reaction-bonded silicon carbide specimen to verify the developed model. Results showed that even with the same maximum momentary force, the material removal rate increased greatly with ultrasonic assistance. The factor k(L) and k(H) did not remain constants as in the original indentation fracture mechanics models, and were highly related to the amplitude of the ultrasonic vibration.