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论文类型：期刊论文

发表时间：2009-10-15

发表刊物：TALANTA

收录刊物：SCIE、EI、PubMed、Scopus

卷号：79

期号：5

页面范围：1341-1347

ISSN号：0039-9140

关键字：Electrode fracture; Polymer deformation behavior; Synchronous observation; Finite element simulation

摘要：Thermal bonding is an important technique to fabricate polymer electrophoresis microchip. However, the metal electrodes deposited on polymer substrate can readily fracture during the thermal bonding. In this paper, poly(ethylene terephthalate) (PET) was exploited to fabricate the electrophoresis microchip with an integrated gold electrode for amperometric detection. The fracture of the gold electrode was studied through FEA (finite element analysis) simulations, the potentially risk positions on the electrode were shown. The calculation results were tested by bonding experiments and were proven to be consistent with the experiments. Besides, an optimal bonding temperature for PET chip was also presented based on FEA simulations and bonding experiments. Considering the low surface properties of PET, oxygen plasma-assisted thermal bonding technique was used to enhance bonding. Upon treated for 150 s, the PET substrates could be thermally bonded at 62 degrees C without electrode fracture. The fabricated PET chips were demonstrated for detection of standard glucose solution. Satisfactory reproducibility was achieved. and the RSD values of peak height and migration time of the PET CE chips were 0.51% and 2.17%, respectively. (C) 2009 Published by Elsevier B.V.