霍林生

个人信息Personal Information

教授

博士生导师

硕士生导师

性别:男

毕业院校:大连理工大学

学位:博士

所在单位:土木工程系

学科:结构工程

办公地点:综合实验4号楼501

联系方式:0411-84706304

电子邮箱:lshuo@dlut.edu.cn

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A Novel Fractal Contact-Electromechanical Impedance Model for Quantitative Monitoring of Bolted Joint Looseness

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论文类型:期刊论文

发表时间:2018-01-01

发表刊物:IEEE ACCESS

收录刊物:SCIE

卷号:6

页面范围:40212-40220

ISSN号:2169-3536

关键字:Structural health monitoring; bolted looseness monitoring; electromechanical impedance modeling; fractal contact theory; piezoceramic transducers

摘要:Bolted joint are among the key components that enable the robust assembly of a wide variety of structures. However, due to wear and tear over time, bolted joint may loosen, and if not detected in its early stages, can lead to devastating results. A monitoring method that can detect bolted joint looseness prior to bolt failure will be essential for the continued operation of the host structure and depending on the situation, the safety of the occupants. Prior research has proven the electromechanical impedance method (EMI) to be an effective technique for detecting the loosening of bolted joints, however, EMI-based methods until now are focused on qualitative health monitoring, which can only provide limited information about the damage. Thus, this paper attempts to quantify EMI based methods through the integration of fractal contact theory, the result of which is a novel electromechanical impedance model for quantitative monitoring of bolted looseness. The method determines the effective impedance of the bolted joint and is applied to develop the relationship between the electrical impedance of a piezoceramic patch installed on the joint and the mechanical impedance of the bolted joint. The mechanical impedance of the bolted joint under various preloads is computed by using the fractal contact theory. Then, the bolted looseness can be monitored quantitatively. At last, a set of verification tests under different applied preload of bolted joint are conducted to verify the validity of the proposed model in this paper.