Associate Professor
Supervisor of Master's Candidates
Project Name:考虑空穴体积率的BGA电子封装材料损伤演化行为特征和塑性本构方程研究
Hits:
Leading Scientist:周长俊
Supported by:其他课题
Status:在研
Date of Project Approval:2022-08-01
Scheduled completion time:2022-11-30
Date of Project Initiation:2022-08-01
Date of Project Completion:2022-11-30
Open time:..
The Last Update Time: ..