杨凤林
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聚吡咯修饰膜开路还原Cr(Ⅵ)的动力学
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Indexed by:期刊论文

Date of Publication:2012-01-01

Journal:功能材料

Included Journals:Scopus、EI、PKU、ISTIC、CSCD

Volume:43

Issue:3

Page Number:303

ISSN No.:1001-9731

Key Words:聚吡咯; 开路还原; 动力学

Abstract:以对甲苯磺酸钠为掺杂剂,在不锈钢电极上电化学合成聚吡咯修饰膜,采用该修饰膜在开路模式下还原Cr(Ⅵ),比较了氧化态和还原态聚吡咯对Cr(Ⅵ)的还
   原作用。结果表明氧化态聚吡咯对Cr(Ⅵ)有较好的吸附作用。但还原态聚吡咯对Cr(Ⅵ)的去除率高于氧化态聚吡咯。提出了聚吡咯修饰膜开路还原Cr(Ⅵ
   )的动力学方程。

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Gender:Male

Alma Mater:大连工学院

Degree:Master's Degree

School/Department:环境学院

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