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论文类型：会议论文

发表时间：2010-11-06

收录刊物：EI、CPCI-S、Scopus

卷号：146-147

页面范围：1375-+

关键字：Electroless plating; Ni-Cu-P coating; Corrosion resistance; Passivation

摘要：Ni-Cu-P coating was synthesized on copper substrate by electroless plating technique. The coating composition and corrosion resistance of Ni-Cu-P coating were characterized using energy-dispersive X-ray (EDX), electron probe micro-analyzer (EPMA), polarization curve (PC) and electrochemical impedance spectrum (EIS). The results show that the chemical nature of anions plays very important roles in the corrosion behavior of Ni-Cu-P coating. At a higher electrolyte concentration, Cl- and SO42- ions tend to promote the dissolution rate of Ni by their adsorption, while at lower electrolyte concentrations, NO3- ions tend to dominate the dissolution rate of Ni-Cu-P coating.