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论文类型：期刊论文

发表时间：2013-01-01

发表刊物：ECS ELECTROCHEMISTRY LETTERS

收录刊物：SCIE、EI、Scopus

卷号：2

期号：7

页面范围：C23-C26

ISSN号：2162-8726

摘要：This work presents a self-healing anticorrosive coating for copper. The 3Dporous copper structure prepared by electrodeposition using hydrogen bubbles as template is used as reservoir for encapsulation of corrosion inhibitor. Defects in the coating trigger a rapid release of encapsulated inhibitor, which confers self-healing properties on the coating. After being scratched with a knife-edge, the composite coating rapidly releases inhibitor embedded in 3D porous film to suppress the corrosion process. The scratch on the coating is covered with inhibitor adsorption film and corrosion products are not found. (C) 2013 The Electrochemical Society. All rights reserved.