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论文类型：期刊论文

发表时间：2012-03-01

发表刊物：ACTA PHYSICA SINICA

收录刊物：SCIE、PKU、ISTIC、Scopus

卷号：61

期号：5

ISSN号：1000-3290

关键字：copper substrate; diamond-like carbon; graded intermediate layer; thermal conductivity

摘要：In recent years, with the rapid development of electronic technology and digital network information, copper has increasing applications in micro-electronics, micro-electro-mechanical systems and Hi-tech materials. However copper has its material limitations. In particular, it has relatively low hardness, high oxidation and wear rate, which have severely restricted its widespread applications. In this paper, aiming at difficulties of copper applications, Ti/TiC/DLC has been proposed as functionally graded material to deposit on the copper substrate with plasma depositing method, which intensifies the adhesion between DLC film and copper substrate and improves the properties of copper. The maximal value of thermal conductivity of DLC film with optimized parameter of graded intermediate layer is 3.63 Wm(-1).K-1, which enhances the heat transfer effect of copper substrate.