Release Time:2019-03-11  Hits:

Indexed by: Journal Article

Date of Publication: 2012-09-25

Journal: Advanced Materials Research

Included Journals: Scopus、CPCI-S、EI

Volume: 565

Page Number: 609-614

ISSN: 9783037854679

Key Words: Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring

Abstract: This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.