Release Time:2019-03-11  Hits:

Indexed by: Journal Article

Date of Publication: 2009-01-01

Journal: Key Engineering Materials

Included Journals: Scopus、EI

Volume: 389-390

Page Number: 475-480

ISSN: 10139826

Abstract: In the process of CMP SiO2 ILD, the nano-particle with high surface energy in slurry has an essential impact on the efficiency and quality of CMP. In this paper the mode of nano-particle on the surface of SiO 2 ILD is analysed and adhesion removal model corresponding to that is established. Through cycle polishing experiments, the change of nano-particle size and the state of particle surface before and after polishing is observed with TEM and Zeta potential analyzer, based on which the adhesion removal model is verified.