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Indexed by:会议论文

Date of Publication:2006-01-01

Included Journals:CPCI-S

Page Number:341-346

Key Words:silicon dioxide; chemical-mechanical polishing (CMP); slurry; dispersant; dispersion and stabilization

Abstract:In manufacturing of the Ultra Large Scale Integrated circuits, the slurry, as an essential factor affecting the chemical and mechanical function during CMP process, has an important impact on the efficiency and quality of CMP for SiO2 Inter Level Dielectric Film. The dispersion and stability, two of the important character parameters of slurry, have a great effect upon surface, scratch, stability of polishing quality and application in practice. In this article the dispersants with different amounts of amidocyanogen are added to self-made slurry respectively. It is observed that the stability of slurry with single amidocyanogen dispersant is better when the weight content of that is around 0.1% through measuring Zeta potential. On the other hand, the Zeta potential of the slurry with hydroxy dispersant goes up gradually along with the amount of that in dispersant. The Steric hindrance effect is enhanced with increasing of the molecular weight of the dispersant. All these factors can improve stability of the slurry. So the stability of the slurry containing polymer dispersant D with a large amount of hydroxy is the best among them when the weight content of dispersant is around 0.3%. In view of the dispersing mechanism and effects for above-mentioned two kinds of dispersants, the polymer dispersant D with many hydroxy is able not only to raise the Zeta potential of the surface of colloid, increasing the electric static repulsive force among particles, but also to effectively enhance the steric repulsion as a result of large molecular chain itself. In result, the slurry is made more stable.