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Indexed by:期刊论文
Date of Publication:2009-01-01
Journal:机械工程学报
Included Journals:PKU、ISTIC
Volume:45
Issue:8
Page Number:18-23
Pre One:Material removal mechanism of chemo-mechanical grinding (CMG) of Si wafer by using soft abrasive grinding wheel (SAGW)
Next One:High aspect ratio micro-hole drilling aided with ultrasonic vibration and planetary movement of electrode by micro-EDM
