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Indexed by:Journal Papers

Date of Publication:2019-12-01

Journal:DIAMOND AND RELATED MATERIALS

Included Journals:EI、SCIE

Volume:100

ISSN No.:0925-9635

Key Words:Diamond; CMP; ReaxFF; Fenton: Nanoscale

Abstract:Single crystal diamond is widely utilized in various high-tech fields due to its many excellent properties, but poor surface quality will affect its applications. Therefore, increased ability to process high-quality diamond will dramatically expand its applications in high-tech fields. A combination of mechanical grinding and chemical mechanical polishing was utilized to propose a new room-temperature polishing method, by means of abrasive particles and transition metal ions. This process activated the diamond surface and resulted in an ultra-smooth surface of Ra 0.452 tun and rms 0.572 nm (measurement area: 283 mu m x 212 mu m), as well as a monoatomic surface layer of Ra 0.115 nm and rms 0.145 tun in a local region (measurement area: 500 nm x 500 nm). The chemical behavior of nanoparticles during the polishing process was studies via reactive force field molecular dynamics simulation. The surface chemical behaviors of both abrasive particles and diamond substrate during the polishing process were elucidated by combining experiments with simulations and the diamond removal mechanism and activated mechanism of Fe2+ were explored. This work provides a theoretical basis and technical support for the ultra-precision machining of single crystal diamond.