DALIAN UNIVERSITY OF TECHNOLOGY
Login
中文
Home
Scientific Research
Research Projects
Published Books
Patents
Paper Publications
Research Field
Teaching Research
Teaching Achievement
Teaching Information
Teaching Resources
Awards and Honours
Other Rewards
Academic Honor
Scientific Awards
Enrollment Information
Student Information
My Album
Blog
Current position:
Home
>>
Scientific Research
>>
Paper Publications
Dongming Guo
Personal Information
Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[131]高航, 吴鸣宇, 付有志, 郭东明, Gao, Hang.流体磨料光整加工理论与技术的发展[J],机械工程学报,2015,51(7):174-187
[132]Gao, Shang, Kang, Renke, Zhang, Bi, Guo, Dongming, Dong, Zhigang, S (reprint author), Dalian Univ Technol, Sch Mech Engn, Inst Adv Mfg Technol, 2 Linggong Rd, Dalian 116024, Peoples R China..Warping of silicon wafers subjected to back-grinding process[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2015,40:87-93
[133]Zhou, Ping, Dong, Zhigang, Kang, Renke, Jin, Zhuji, Guo, Dongming, P (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing wi...[J],INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2015,77(1-4):107-116
[134]翟昌恒, 张亮, 郭东明, 金洙吉, 郭晓光.光学石英玻璃纳米划痕性能仿真研究(英文)[J],强激光与粒子束,2015,02:267-271
[135]吴东江, 范聪, 刘士博, 马广义, 郭玉泉, 牛方勇, 郭东明, Wu, DJ (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China..激光偏移量对Hastelloy C-276/316L焊缝腐蚀性能的影响[J],稀有金属材料与工程,2015,44(02):498-502
[136]翟昌恒, 郭晓光, 金洙吉, 郭东明, 张亮, Guo, Xiaoguang.光学石英玻璃纳米划痕性能仿真研究[J],强激光与粒子束,2015,27(2):259-263
[137]Guo, Xiaoguang, Zhai, Changheng, Liu, Ziyuan, Zhang, Liang, Jin, Zhuji, Dongming, CH (reprint author), Dalian Univ Technol, Minist Educ, Key Lab Precis Nontradit Machining, Dalian 116024, Peoples R China..Effect of stacking fault in silicon induced by nanoindentation with MD simulation[J],MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2015,30:112-117
[138]高尚, 董志刚, 康仁科, 张璧, 郭东明.Warping of silicon wafers subjected to back-thinning process[J],Precision Engineering,2015,40(-):87-93
[139]郭晓光, 金洙吉, 郭东明.Simulation of nanoscratch properties of quartz glass with molecular dynamics method[J],High power laser and particle beams,2015,27(2):1-5
[140]高尚, 郭东明, 康仁科, 朱祥龙.Surface and subsurface integrity of glass-ceramics induced by ultra-precision grinding[A],2015
total751 14/76
first
previous
next
last
Page