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Dongming Guo
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Professor Supervisor of Doctorate Candidates Supervisor of Master's Candidates
Paper Publications
[601]Guo, D.M., Liu, M.J., Kang, R.K., J.M..Determination of the Grinding Area and Allowance in the Radome Grinding[A],2003,258-259:174-179
[602]Kang, R.K., Guo, X.G., D.M., Jin, Z.J..Towards a Deep Understanding of Molecular Dynamics Simulation in Nanometric Machining[A],2003,258-259:216-220
[603]郭东明, 康仁科, 苏建修, 金洙吉, Guo, D..超大规模集成电路制造中硅片平坦化技术的未来发展[J],机械工程学报,2003,39(10):100-105
[604]苏建修, 康仁科, 郭东明.超大规模集成电路制造中硅片化学机械抛光技术分析[J],半导体技术,2003,28(10):27-32
[605]杨睿, 贾振元, 刘碧静, 郭东明, 康仁科.理想材料零件RP制造中的生长方向优化研究[J],中国机械工程,2003,14(19):1701-1703
[606]冯冬菊, 赵福令, 徐占国, 郭东明.超声波加工工具对复合变幅杆谐振性能的影响[A],2003,162-164
[607]郭东明, 刘碧静, 杨睿, 贾振元, 康仁科.理想材料零件数字化设计制造研究现状[J],机械科学与技术,2003,22(5):702-704
[608]康仁科, 郭东明, 霍风伟, 金洙吉.大尺寸硅片背面磨削技术的应用与发展[J],半导体技术,2003,28(9):33-38,51
[609]康仁科, 郭东明, 霍风伟, 金洙吉.大尺寸硅片背面磨削技术的应用与发展[A],2003,78-83,95
[610]康仁科, 田业冰, 郭东明, 金洙吉.大直径硅片超精密磨削技术的研究与应用现状[J],金刚石与磨料磨具工程,2003,4:13-18,25
total751 61/76
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