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论文类型：期刊论文

发表时间：2012-04-01

发表刊物：MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS

收录刊物：SCIE、EI、Scopus

卷号：18

期号：4

页面范围：481-488

ISSN号：0946-7076

摘要：A flexible microfluidic chip is difficult to fabricate using the standard hot embossing technology. In this study, rubber-assisted embossing of polymer thin films using molds with through-thickness microchannels was investigated. The polymer film was thermoformed into the microchannels by rubber as a soft counter-tool. Different processing conditions, as well as material selections, affecting the thickness uniformity and replicated depth were examined. Results indicated that smoother surfaces on the embossed articles were created, and the thickness uniformity and the depth of the embossed channel were significantly affected by the embossing temperature, the embossing pressure, and the rubber hardness. The embossed film was sealed on one side with a layer of transparent adhesive film to form closed microchannels, and desired 3-D flow characteristics were obtained with this flexible microfluidic chip.