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论文类型：期刊论文

发表时间：2014-03-01

发表刊物：JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE

收录刊物：SCIE、EI、Scopus

卷号：23

期号：3

页面范围：1069-1076

ISSN号：1059-9495

关键字：damage evolution; interface debonding; microstructure-based model; SiCp/Al composites

摘要：Modeling and prediction of the damage evolution in particle reinforced composites is a complex problem. Microstructure characters such as the particle morphologies, sizes, and distribution significantly affect the damage evolution in composites. A numerical simulation has been performed to investigate the damage evolution of SiCp/AA2009 composites. Tensile deformation in SiCp/AA2009 composites was simulated using the microstructure-based model constructed from the metallograph. Matrix damage, particle cracking, and interface debonding were simulated combining the ductile damage model, the normal stress criterion, and the maximum stress ratio criterion. The simulation results show that under tensile loading, damage initiates at the interface, and then propagates along the weakest direction. The simulation microstructures agree well with experimental results in which interface debonding, particle cracking, and matrix damage co-exist. In addition, the effects of component properties on the damage evolution are examined for various situations.