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论文类型：期刊论文

发表时间：2010-04-01

发表刊物：EXPERIMENTAL HEAT TRANSFER

收录刊物：SCIE、EI、Scopus

卷号：23

期号：2

页面范围：107-116

ISSN号：0891-6152

关键字：thermal contact conductance; steady-state heat flux method; high temperature; experimental investigation

摘要：Based on the steady-state heat flux method, the effects of interfacial temperature (320 degrees C-550 degrees C) and contact pressure (2.96-15.68 MPa) on the contact heat transfer were investigated by a new experimental apparatus and method. To accurately measure the interfacial temperature drop, six thin specimens, alternately overlapped together between two test specimens, were applied. The experimental results show that thermal contact conductance increases with the increase of interfacial temperature and contact pressure generally. In addition, the variation of thermal contact conductance for different contact pressure is more obvious at higher temperature. The basic tendency of the power law correlation between thermal contact conductance and contact pressure agrees well with that of available theoretical models.