点击次数：

论文类型：期刊论文

发表时间：2018-01-01

发表刊物：NUMERICAL HEAT TRANSFER PART A-APPLICATIONS

收录刊物：SCIE

卷号：73

期号：8

页面范围：553-564

ISSN号：1040-7782

摘要：Molecular dynamics simulations were performed to investigate the effect of nanoparticle deposition and nondeposition on the explosive boiling heat transfer. Both particle state (deposition and nondeposition) and metal surface structure (smooth and rough) were considered to study the boiling behavior. Particularly for the rough surface, a special deposition case was simulated that the deposition nanoparticle was not filled with the pit. The results showed that the addition of nanoparticles enhanced the boiling behavior. The histories of argon temperature, net evaporation number, as well as heat flux demonstrated that deposition nanofluid boiling heat transfer enhancement behavior was the highest.