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发表时间：2018-01-01

发表刊物：工程热物理学报

卷号：39

期号：5

页面范围：1112-1117

ISSN号：0253-231X

摘要：The pool boiling of nanofluids on the metal surface was investigated by
   molecular dynamics simulations to reveal the mechanisms responsible for
   the favorable heat transfer properties of nanofluids. The simulated
   system was consisted by four regions: vapor argon, liquid argon, solid
   copper and nanoparticles copper. Particularly, the nanoparticles were
   placed near the metal surface. Two superheated temperatures were
   considered. The results showed that the fluid temperature and net
   evaporation rate were increased by the addition of nanoparticles. The
   nanoparticles had random movement and did not move with the fluid. It
   was also observed that the nanoparticles size and the superheated
   temperature had significant effect on the enhancement effects.

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