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论文类型：期刊论文

发表时间：2011-08-01

发表刊物：INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER

收录刊物：SCIE、EI

卷号：38

期号：7

页面范围：874-878

ISSN号：0735-1933

关键字：Evaporating thin film; Molecular dynamics simulation; Velocity slip; Temperature jump; Solid-liquid interface

摘要：A new mathematical model is developed to predict heat and mass transport characteristics of the evaporating thin film. The model considers effects of velocity slip and temperature jump at the solid-liquid interface, disjoining pressure, and surface tension. Three-dimensional nonequilibrium molecular dynamics simulations for coupling between the momentum and heat transfer at the nanoscale solid-liquid interface are performed to obtain the slip length and interfacial thermal resistance length. It is found that both slip length and interfacial thermal resistance length decrease significantly with the decreasing interface wettability of the liquid to the wall. Velocity slip and temperature jump at the solid-liquid interface intend to reduce the superheat degree of the evaporating thin film, and thus result in a sharp decrease of the heat and mass transport characteristics of the evaporating thin film. It is also noted that velocity slip and temperature jump at the solid-liquid interface show a more pronounced effect as the superheat degree increases. (C) 2011 Elsevier Ltd. All rights reserved.