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Preparation and characterization of osmium films on quartz substrate by magnetron sputtering method

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Indexed by:Journal Papers

Date of Publication:2015-11-25

Journal:SURFACE & COATINGS TECHNOLOGY

Included Journals:SCIE、EI、Scopus

Volume:282

Page Number:1-5

ISSN No.:0257-8972

Key Words:Os films; Magnetron sputtering; Mechanical properties; Resistivity

Abstract:Micron-thick osmium films were deposited on quartz substrates with a pulsed -200 V bias using magnetron sputtering method. Application of similar to 100 nm Ti buffer layer resulted in successful deposition of as thick as similar to 3 mu m Os films. Structure and morphology of the films were studied in terms of X-ray diffraction, scanning electron microscopy and atomic force microscopy, and their dependence on the duty-ratio was revealed. The mechanical properties of the films, namely, the Young's modulus and the hardness, were studied and discussed in comparison with the measurement of Os bulk sample. The Os film was found to be similar to 40% harder than the bulk sample due to the internal stress and the refined grains. The thickness-dependent resistivity was determined to be rho = 13.0 + 1.74/t (mu Omega cm), where t is the film thickness in micron. (C) 2015 Elsevier B.V. All rights reserved.

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