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沉积工艺对高k栅介质ZrO2薄膜生长行为的影响

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Indexed by:期刊论文

Date of Publication:2007-07-01

Journal:无机材料学报

Included Journals:SCIE、EI、PKU、ISTIC、CSCD、Scopus

Volume:22

Issue:4

Page Number:742-748

ISSN No.:1000-324X

Key Words:ZrO2薄膜;射频磁控溅射;薄膜生长;微结构

Abstract:采用反应射频磁控溅射法在Si(100)基片上制备了ZrO2薄膜,通过高分辨电子显微镜、原子力显微镜,研究了沉积工艺参数(主要包括氧分压和沉积温度)对ZrO2薄膜的表面形貌和微结构的影响.研究结果显示:氧分压和沉积温度是影响ZrO2薄膜生长行为的重要因素.随氧分压的增大,ZrO2薄膜的表面粗糙度近乎呈线形增加的趋势,ZrO2薄膜微结构演化过程是a-ZrO2(非晶)→a-ZrO2和少量m-ZrO2(单斜)→m-ZrO2和少量t-ZrO2(四方)→m-ZrO2;随沉积温度从室温升高到550℃,ZrO2薄膜微结构演化过程是a-ZrO2(<250℃)→m-ZrO2和少量a-ZrO2(450℃)→m-ZrO2和少量t-ZrO2(550℃);此外,根据薄膜微结构和表面形貌的研究结果,探讨了沉积温度对薄膜生长行为的影响及其物理机制.

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