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Influence of Defects During the Tensile Deformation of Cu-Al Joint Interfaces at the Nano Scale

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Indexed by:期刊论文

Date of Publication:2011-10-01

Journal:JOURNAL OF COMPUTATIONAL AND THEORETICAL NANOSCIENCE

Included Journals:Scopus、SCIE、EI

Volume:8

Issue:10

Page Number:2050-2057

ISSN No.:1546-1955

Key Words:Heterogeneous Metal Interface; Mechanical Behavior; Molecular Dynamics; Microstructure; Dislocations

Abstract:Tensile deformation of a defective Cu/Al interface, which is used as a model system of heterogeneous metal interfaces, is explored using molecular dynamics simulations and compared with the mechanical behavior of copper grain boundaries. Results show that the heterogeneous bonding across the interface is a weaker link of the system during mechanical loading as compared with pure copper grain boundaries. Interfacial ductile fracture is the main mechanical failure mode accompanied by the nucleation and growth of voids near the interfacial region, which differs from the fracture mode of copper grain boundary. Evolution of the microstructures and its dependency on the external loading are examined with the interface models during the deformation process. In some cases of a defective interface, the nucleation of partial dislocation loops is observed and analyzed.

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