Release Time:2019-03-10  Hits:

Indexed by: Journal Article

Date of Publication: 2009-01-26

Journal: PHYSICS LETTERS A

Included Journals: SCIE

Volume: 373

Issue: 5

Page Number: 570-574

ISSN: 0375-9601

Key Words: Nanocrystalline copper; Molecular dynamics simulation; Plastic deformation; Dislocation; Grain growth

Abstract: The plastic deformation of nanocrystalline copper subjected to tension has been studied using molecular dynamics simulation. The results show that, in the initial stage, the deformation is mainly boundary-mediated in small grains; while in the late stage, the deformation is accommodated by dislocations in large grains. It is also found that the stress-assisted grain growth occurs owing to atomic diffusion and grain boundary migration. These results are consistent with recent experimental observations. (c) 2008 Elsevier B.V. All rights reserved.